What Is Surface Mount Technology?
Most of the commercial-electronics are made up of complex circuitry that fit into small spaces. These components have to be mounted directly onto a circuit board instead of wired. This explanation is the general description for Surface Mount Technology.
The Importance Of Surface Mount Technology
A large majority of the current electronics of today are manufactured using SMT (Surface Mount Technology). The products and devices which use SMT have many benefits over the traditionally routed-circuits, which are devices called SMDs, which stands for Surface Mount Devices. These stand out advantages have made sure that SMT has continued to dominate the PCB industry since conception.
The Benefits Of SMT
– The primary advantage for SMT is that it allows for automated soldering and production. This technique is time and cost saving which provides a way for far more logical circuits. Savings in the manufacturing costs in most cases are passed onto consumers, which makes it beneficial for all the people involved.
– Fewer holes are required in the circuit boards
– The costs are less than the through-hole equivalent parts
– SMT components are a lot smaller
– Each side of the circuit board can accommodate components
– Increased component density
– Increased performance under vibration and shake conditions
SMT Device Types
SMDs or Surface Mount Devices are the devices which use SMT. The different components that are used and specifically designed so that they can be soldered onto the board directly instead of wired between 2 points. Currently, there are three main categories for the SMT components.
1. Passive SMDs
Most of the passive SMDs are capacitors or resistors. Package sizes for this component type are very well-standardized, while other components that include crystals, coils along with others usually have requirements that are more specific.
2. Integrated Circuits
In association to SMD specifically, these vary extensively dependent on the connectivity required.
3. Diodes And Transistors
Diodes and transistors are found in small plastic packages. The leads are what forms connections which touch onto the board. These types of packages typically use three leads.
The History Of SMT
SMT or Surface Mount Technology became used widely in the 1980s, and the popularity has continued to increase over the years. The PCB producers soon realized that SMT devices were a lot more efficient to produce compared to the existing methods. SMT provided a way for the production to be extremely mechanized.
In previous years, PCBs used wired to connect the components. The wires were hand administered using a through-hole method. Holes on the surfaces of these boards would be wired by threading through, and the wires are what connected the different components. In the past, PCBs required humans for the process of manufacture. SMT went onto remove this step out of these processes. Instead, components are now soldered onto the pads on each board.
The Progression Of SMT
The way in which SMT has offered its benefits to mechanization resulted in its usage spreading quickly throughout these industries. This technique resulted in new sets of components that were created to accompany this technology. These were in most cases smaller in comparison to the through-hole counterparts. SMDs provided a way to achieve a far higher pin count. Generally, SMTs are also far more compact compared to through-hole circuit boards, which resulted in a decrease in transportation costs.
At Cal-Chip Electronics Inc.
We are well-positioned to meet the demands of this technology evolution. As the largest stocking manufacturers of passive surface mounted components, Cal-Chip has prepared its stocking position and factory supply chain to meet the passive component demand this coming boom will create. From capacitors and resistors to ferrite beads, inductors, and Hi CV products, Cal-Chip is your one-stop solution for all your passive component needs.
Specifically, the products that we provide include ceramic chip, MLCC = multi-layer chip capacitor, MLCC capacitors, multi-layer chip resistors, chip capacitor, polymer chip capacitors, polymer capacitors, electrolytic capacitors, high Q capacitors, capacitor arrays, resistor arrays, chip resistor, resistor, thick film resistor, thin film resistor, automotive grade resistor, current sensing resistors, auto-grade resistors, multi-layer (ML) chip inductor, chip inductor, wire-wound SMD inductors, power inductors, polymer chip inductor, shielded inductors, multi-layer chip ferrite beads, chip ferrite beads, and ferrite beads.